{"id":"2321a429-7eab-4ac2-aa81-d92522d8857f","title":"Sr. Manager Packaging Engineering","company":{"id":"6cc73240-2fbe-496a-8b71-0427d8086855","name":"AMD","website":"https://careers.amd.com","url":"https://yesjob.brogu.ca/companies/6cc73240-2fbe-496a-8b71-0427d8086855"},"url":"https://yesjob.brogu.ca/jobs/2321a429-7eab-4ac2-aa81-d92522d8857f","apply_url":"https://canadacareers-amd.icims.com/jobs/87557/login","status":"open","location":"Markham, Ontario, Canada","locations":[{"city":"Markham","region":"ON","country":"CA"}],"workplace":null,"remote_eligible_countries":[],"employment_types":["full_time"],"work_auth_required":"unspecified","term":null,"salary_cad_per_year":null,"languages_required":[],"seniority":null,"first_seen_at":"2026-11-05T21:24:52.403Z","last_seen_at":"2026-11-06T03:25:38.868Z","salary_text":null,"summary":"- Senior manager role leading Data Center GPU / MI package design execution at AMD, with a team of package design engineers across geographies.\n- Location listed as Markham, Ontario, Canada; full-time per the ATS label. No salary, workplace (remote/hybrid), or work authorization terms are stated.\n- Requires a B.S. or higher in Electrical/Computer/Mechanical Engineering or a related field; preferred experience includes semiconductor packaging, OSAT/substrate work, and tools like Synopsys 3DICC or Cadence SiP/APD.","sources":["https://careers.amd.com/jobs/87557"]}