{"id":"e95242d8-13f5-435f-beb5-821d809b76c3","title":"Semiconductor Packaging Modeling and Simulation Engineer","company":{"id":"9f340da3-e35d-4c71-9fc2-2765b2b21894","name":"Hctz","website":"https://hctz.fa.us2.oraclecloud.com","url":"https://yesjob.brogu.ca/companies/9f340da3-e35d-4c71-9fc2-2765b2b21894"},"url":"https://yesjob.brogu.ca/jobs/e95242d8-13f5-435f-beb5-821d809b76c3","apply_url":"https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2506624","status":"open","location":"Waterloo, ON, Canada","locations":[{"city":"Waterloo","region":"ON","country":"CA"}],"workplace":null,"remote_eligible_countries":[],"employment_types":["full_time"],"work_auth_required":"unspecified","term":null,"salary_cad_per_year":{"max":127000,"min":76900},"languages_required":["en"],"seniority":"mid","first_seen_at":"2026-11-05T17:27:43.879Z","last_seen_at":"2026-11-08T12:07:32.164Z","salary_text":null,"summary":"- Thermal-mechanical modeling and simulation role on onsemi's Corporate R&D team in Waterloo, ON, covering packaging assembly (Ag/Cu sintering) and reliability.\n- Requires a Master's or PhD in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials, plus 2-3+ years of relevant experience.\n- Needs FEA skills (ANSYS Mechanical APDL/Workbench), SolidWorks, Unix/Linux, and strong English communication.\n- Base salary stated as $76,900 to $127,000 (annual, currency not explicitly stated); no work authorization or remote terms given.","sources":["https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2506624"]}